ASU is poised to be at the forefront of progress in the design and manufacture of microchips and the advanced packaging techniques that boost chip performance. The university is partnering with NXP Semiconductors to improve packaging techniques and has Arizona Commerce Authority funding to increase semiconductor research, development and workforce training. It’s part of multiple efforts to make ASU an advanced packaging leader, says Professor Zachary Holman, Fulton Schools vice dean for research and innovation. Christopher Bailey, a professor in the School of Electrical, Computer and Energy Engineering, part of the Fulton Schools, says students pursing degrees in various areas of engineering are being trained in advanced semiconductor packaging.