
How Arizona is Growing its Advanced Packaging Capabilities
Advanced packaging technologies such as 2.5D and 3D stacking are at the forefront of major advances in the fast-emerging semiconductor technology assembly field. ASU has been gaining stature as an innovator in the fast-growing industry. Fulton Schools’ Vice Dean for Research and Innovation Zachary Holman, talks about the evolution of the university’s efforts to provide increasingly robust advanced packaging tools and processes. Research and development progress is also helping to place ASU and the Fulton Schools higher among the leaders in educating the next generation of professionals in the field, as well as expanding the horizons of advanced semiconductor packaging.
See also: How semiconductor industry is poised to power Arizona economy in 2025, AZ Big Media, January 20
ASU and the Fulton Schools are credited for a major role in the education needed to provide the current and future workforce needed by the robust semiconductor and related manufacturing fields.
ASU selected as home and partner for CHIPS and Science Act-funded national lab for semiconductor advanced packaging, Tha Manufacturer, January 16
Tempe will be home to a new national research lab for semiconductor microchips, KJZZ News-Phoenix, January 17