ASU’s place among top-tier research universities is being further cemented by the recent by the National Semiconductor Technology Center’s selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. To be located at the ASU Research Park, work the new facility will help pave the way for major advances in the U.S. semiconductor ecosystem strengthening the U.S. semiconductor supply chain and accelerate cutting-edge research and development. The Fulton Schools will support the facility through ASU’s Core Research Facilities and state-of-the-art research labs.

See also: Arizona will host third CHIPS R&D flagship facility, Manufacturing Dive, January 8

ASU Research Park in Tempe chosen for national semiconductor test facility, KTAR News-Phoenix, January 7 (updated)

ASU selected as home, partner for CHIPS, Electronic Products and Technology, January 6

ASU Research Park named one of nation’s 3 ‘flagship’ R&D facilities for microchips, Arizona Republic, January 6

Arizona State selected as third CHIPS Act facility, 3TV/CBS 5 News – Phoenix, January 6

ASU Research Park to be home to major Chips for America research and development facility, ABC 15 Arizona, January 6

ASU to host state-of-the-art CHIPS for America R&D facility, 12 News-Phoenix, January 6

Arizona, ASU score CHIPS for America flagship semiconductor facility, Phoenix Business Journal, January 6

ASU Research Park named flagship CHIPS R&D facility for U.S., AZ Big Media, January 6

Arizona State selected as third CHIPs Act facility, MSN, January 6

Commerce Dept picks Arizona to host chip packaging research lab, Capacity Media, January 6

Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility, U.S. Department of Commerce, January 6  (news release)

Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility, National Semiconductor Technology Center, January 6 (news release)

Arizona and ASU Selected For Flagship Prototyping And Advanced Packaging R&R Facility, Arizona Commerce Authority, January 6 (new release)

Read more in Business Facilities Magazine, HPC Wire, Arizona Senator Mark Kelly Newsroom, The American News, PIC (Photonics Integrated Circuits) Magazine, Semiconductor Industry Association, Construction Review, The Oregonian, Yahoo! News, inBusiness (Greater Phoenix), eeNewsEurope-Technology News, Shiksha Study Abroad (India), Daily Independent, Natcast (NIST’s CHIPS & Science Act’s operations arm), Tempe.Gov, Border Now, Blog for Arizona, Arizona Technology Council, Converge! Network Digest, Natcast (NIST’s CHIPS & Science Act’s operations arm), Albany (New York) Times Union