ASU is partnering with Deca Technologies, a leading provider of advanced wafer- and panel-level packaging technology, to develop North America’s first Fan-Out Wafer-Level Packaging research and development capability. The new Center for Advanced Wafer-Level Packaging Applications and Development will strive to significantly expand U.S. semiconductor manufacturing capabilities through advances in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing. Zachary Holman, the Fulton Schools vice dean for research and innovation, says the venture will propel progress toward development of the next generation of microelectronics.

See also: ASU and Deca Technologies team up for first such microchip research in North America, Arizona Republic, March 19

ASU, Tempe’s Deca Technologies collaborate on new semiconductor advanced packaging research center, Phoenix Business Journal

ASU and Deca lead North America’s first advanced fan-out wafer-level packaging R&D center, R&D World, March 19

ASU and Deca team up to open research center, Evertig, March 20