In what ASU President Michael Crow says is a critical step for the U.S. to achieve independence in semiconductor manufacturing, the U.S. Department of Commerce has announced an award of up to $100 million in funds to propel innovation in semiconductor packaging. A team led by ASU and Deca Technologies, based in Tempe, has qualified for funding. Fulton Schools leaders and researchers have been collaborating with industry leaders such as the Taiwan Semiconductor Manufacturing, or TSMC, company, which is continuing to expand its state-of-the-art facility in Phoenix (pictured). The new funding will be used for research and development to boost commercial development of new technologies, strengthen supply chains and expand workforce development.

See also: ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities, ASU News, November 21

ASU and Deca Technologies will lead $100 million semiconductor project, AZ Big Media, November 22